THICK FILM PASTES for HEATERS ON STEEL APPLICATIONS
DIELECTRICS FOR INSULATING STEEL
DM-INS-14100 is a blue insulating dielectric specifically designed for use on Ferritic 430 S/S. It is typically used in heater on steel applications as the insulation layers and overglaze Fired at 850°C TDS
DM-INS-14500 is a blue insulating dielectric specifically designed for use on Austenitic 304 S/S. It is typically used in heater on steel applications as the insulation layers and overglaze Fired at 850°C TDS
RESISTANCE HEATING TRACKS
DM-RES-14401S 100mΩ/□ Ag/Pd resistor heater track 1500 ppm TDS
DM-RES-14402S 200mΩ/□ Ag/Pd resistor heater track 1500 ppm TDS
DM-RES-14201S 100mΩ/□ Ag resistor heater track 3000 ppm TDS
DM-RES-14301S 100mΩ/□ Ag/Pt resistor heater track 1950 ppm TDS
DM-RES-14302S 200mΩ/□ Ag/Pt resistor heater track 1950 ppm TDS
TERMINATION MATERIALS
DM-SIP-14001S Pure Ag conductor 850°C Firing TDS
DM-SIP-14005S Pure Ag conductor 550-650°C Firing TDS
DM-SIP-14031S Ag/Pd conductor/termination 850°C Firing TDS
DM-SIP-14020S Ag/Pt conductor 850°C Firing (1% Pt) TDS
CERMET/HIGH TEMPERTURE/850°C FIRING PASTES
SILVER PALLADIUM
DM-SIP-14031S is a mixed bonded general purpose solderable silver/palladium cermet paste for use as conductive tracks or termination. Fired at 850°C TDS
DM-SIP-14033S is a mixed bonded 3:1 solderable silver/palladium cermet paste for use as conductive tracks or terminations. Fired at 850°C TDS
SILVER
DM-SIP-14001S High temperature thick film screen printable silver paste (<3 mΩ/□ at 12um) for automotive, heater on steel and other industrial/consumer applications. Fired at 850°C TDS
DM-SIP-14001S-FL High temperature Fine Line thick film screen printable silver paste (<3 mΩ/□ at 12um) for automotive and other industrial/consumer applications. Fired at 850°C TDS
DM-SIP-14005S Pure Ag conductor with Fine Line capability. Fired at 550-650°C TDS
SILVER / PLATINUM
DM-SIP-14020S is a mixed bonded solderable silver/platinum (1%) conductor cermet paste. Fired at 850°C TDS
DM-SIP-14021S is an RoHS compliant mixed bonded solderable silver/platinum (2%) conductor cermet paste. Fired at 850°C TDS
DM-SIP-14022S is an RoHS compliant mixed bonded solderable silver/platinum (3%) conductor cermet paste. Fired at 850°C TDS
SILVER CONDUCTOR ON GLASS
DM-SIP-14005S High temperature thick film screen printable silver paste (<3 mΩ/□ at 12um) for use on glass and ceramics. Fired at 525-700°C. TDS
PLATINUM
DM-PTP-14050S is a screen-printable fritted platinum conductor paste for use on alumina and Dycotec Materials high temperature dielectrics. Firing between 850 and 1300°C, it produces a highly conductive, dense layer suitable for a range of applications including zirconia oxygen sensors. TDS
GOLD
DM-AUP-14040S is a screen-printable mixed bonded gold conductor paste for use on alumina and Dycotec Materials high temperature dielectrics. It produces smooth, dense layers when fired between 850 and 980°C. This conductor is suitable for wire bonding with both Al and Au small diameter wire. TDS
OVERGLAZE
DM-OVG14550 Laser Trimmable, 525-650°C firing, Green coloured overglaze for Thick Film Resistor protection. TDS
POLYIMIDES
POLYIMIDE INSULATOR
DM-IN-7080S is a screen-printable polyimide-derived dielectric for use in applications up to 300°C, as a base layer or overcoat. The paste is compatible with a range of substrates including glass, PI, ceramics and metals including 316/304 steel, aluminium and copper. Curing between 200-350°C, the product is suitable for continuous operation at 200-275°C with intermittent use up to 300°C. TDS
DM-SIP-3080S is a screen-printable silver-polyimide conductor paste designed for high temperature applications exceeding the standard operating conditions of typical polymer silver conductor pastes. The paste is compatible with a range of substrates including glass, PI, ceramics and dielectric coated metals. Curing between 200-350°C, the product is suitable for continuous operation at 200-250°C with intermittent use up to 350°C. TDS
POLYMERS
POLYMER SILVER
DM-SIP-3060S is a screen printable silver paste for membrane, thin film PV and general printed electronics applications. The paste is compatible with low temperature substrates such as PET due to its low curing temperature (25-140ºC). TDS
DM-SIP-3071S(130-150ºC). 60-65% SOLIDS TDS
DM-SIP-3072S (100-150°C for 10-30 mins) 74-77% SOLIDS TDS
POLYMER INSULATOR
DM-IN-7021S 120-130°C. Screen Printed Thermally Cured Insulator paste for Rigid Substrates TDS
POLYMER PROTECTIVE COATINGS
DM-OC-6050S is a 150°C curing robust thermoset polymer protective overcoat for hybrid circuit, heaters and PCB applications. TDS
DM-OC-6060S is a 150°C curing thermoset epoxy protective semi translucent, laser trimmable protective overcoat for hybrid circuit, heaters and PCB applications. TDS
